Journal Article

• Soil clay minerals abundance mapping using AVIRIS-NG data Advances in Space Research Elsevier ISSN: 0273-1177 29 Sep. 2022 10.1016/j.asr.2022.09.049
• Assessing Mobile Usage Physical Activity and Sleep Through Smartphone Sensing: A Digital Phenotype Study SN Computer Science, Springer vol. 03, Issue 5, article no.: 331 13 Jun. 2022 doi: 10.1007/s42979-022-01221-x.
• 10 Years of Natural Data Storage IEEE Transactions on Molecular, Biological and Multi-Scale Communications IEEE ISSN: 2332-7804 03 Oct. 2022 10.1109/TMBMC.2022.3211446
• Multi-resolution approach to human activity recognition in video sequence based on combination of complex wavelet transform Local Binary Pattern and Zernike moment Multimedia Tools and Applications, 1174: Futuristic Trends and Innovations in Multimedia Systems Using Big Data, IoT and Cloud Technologies (FTIMS) 04 Feb. 2022. doi:10.1007/s11042-021-11828-6.
• Time-Domain Techniques for Line Protection Using Three-Dimensional Cartesian Coordinates IEEE Transactions on Power Delivery, Institute of Electrical and Electronics Engineers Inc. 2021 doi: 10.1109/TPWRD.2021.3135897.
• Structure Fortification of Mixed CNT Bundle Interconnects for Nano Integrated Circuits Using Constraint-Based Particle Swarm Optimization IEEE Transactions on Nanotechnology, vol. 20 pp. 194-204 11 Feb. 2021 doi: 10.1109/TNANO.2021.3058760.
• Measuring structural parameters of crosslinked and entangled semiflexible polymer networks with single-filament tracing  Physical Review E, American Physical Society vol. 103, issue. 6 Article No. 62501 2021 doi: 10.1103/PhysRevE.103.062501.
• Handwritten Digit Recognition Using Bayesian ResNet SN Computer Science, Springer vol. 2, Article no. 399 pp. 1-10 2 Aug. 2021 doi: 10.1007/s42979-021-00791-6
• Controlled g-frames in Hilbert C*-modules Mathematical   Analysis and its  Contemporary Applications, vol. 3, no. 3 pp. 65-82 Summer 2021 doi: 10.30495/maca.2021.1937063.1023
• A prominent unified crosstalk model for linear and sub-threshold regions in mixed CNT bundle interconnects Microelectronics Journal, Volume118, pp.105294 Dec. 2021 doi: 10.1016/j.mejo.2021.105294.